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PROCESS DETAIL · AP-004
Process DetailSemicon Process — Bump / UBM / Re-work
AP-004 · Semicon Process — Bump / UBM / Re-workAP-004 · Electronics · Circuit
PROCESS INFORMATION · AP-004
Semicon Process — Bump / UBM / Re-work
Electronics · Circuit- Process ID
- AP-004
- Process Categories
- Electronics · Circuit
- Process Overview
- This group of chemicals is used for solder bump formation, UBM (Under Bump Metallurgy) etching, and defective-bump rework in wafer-level packaging. Because this process centers on selecting chemicals by function rather than following a fixed sequence of steps, the information is provided as a chemical composition table.
- Applications
- Semiconductor wafer, solder bump, Au bump, chip
- Related Industries
- Semiconductor