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PROCESS DETAIL · AP-002
Process DetailDesmear Plating Process
AP-002 · Desmear Plating ProcessAP-002 · Electronics · Circuit
PROCESS INFORMATION · AP-002
Desmear Plating Process
Electronics · Circuit- Process ID
- AP-002
- Process Categories
- Electronics · Circuit
- Applications
- Multi-layer printed circuit board (MLB)
- Related Industries
- PCB
Process Sequence
7 steps
| Process order | Process Name | Process Description | Recommended product |
|---|---|---|---|
| 1 | Sweller | Performs swelling action to remove smear and increase adhesion. Enhanced conditioner effect using solvent. Has softening and swelling effects on resin smear. | MS-D1000 |
| 2 | rinsing | — | — |
| 3 | Epoxy Etching | Removes swollen smear with a powerful alkaline oxidizer. Provides micro-porous functionality on the hole inner wall. | MS-D1100 |
| 4 | rinsing | — | — |
| 5 | Neutralizer | It is a mildly acidic reducer for neutralizing and removing residual oxidizer. It does not attack metallic components. | MS-D1200 |
| 6 | rinsing | — | — |
| 7 | Drying | — | — |
Pre-treatment
Material preparation
- STEP1
Sweller
Performs swelling action to remove smear and increase adhesion. Enhanced conditioner effect using solvent. Has softening and swelling effects on resin smear.
Recommended productMS-D1000 - 2rinsing
- STEP3
Epoxy Etching
Removes swollen smear with a powerful alkaline oxidizer. Provides micro-porous functionality on the hole inner wall.
Recommended productMS-D1100 - 4rinsing
- STEP5
Neutralizer
It is a mildly acidic reducer for neutralizing and removing residual oxidizer. It does not attack metallic components.
Recommended productMS-D1200