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PROCESS DETAIL · AP-001
Process DetailPCB · PTH Plating Process
AP-001 · PCB · PTH Plating ProcessAP-001 · Electronics · Circuit
PROCESS INFORMATION · AP-001
PCB · PTH Plating Process
Electronics · Circuit- Process ID
- AP-001
- Process Categories
- Electronics · Circuit
- Applications
- Printed Circuit Board (Epoxy Resin / Glass Fiber)
- Related Industries
- PCB
Process Sequence
12 steps
| Process order | Process Name | Process Description | Recommended product |
|---|---|---|---|
| 1 | Clean & Conditioner | Removal of fine oxide film on copper surface | MS-C2000 |
| 2 | rinsing | — | — |
| 3 | Soft Etching | Forms fine irregularities on the board surface to enhance plating adhesion through anchoring effect and increased surface area. Functions to remove oxide film and neutralize residual alkali. | MS-C2100 |
| 4 | rinsing | — | — |
| 5 | Pre-Dip | Imparts wettability to prevent rinse water from entering the bath, protect the catalyst, and facilitate Pd adsorption | MS-C2200 |
| 6 | Catalyst | Pd colloid adsorption | MS-C2300 |
| 7 | rinsing | — | — |
| 8 | Accelerator | Catalyst activation | MS-C2400 |
| 9 | rinsing | — | — |
| 10 | E'less Cu (Electroless copper) | Through-hole metallization · Electroless copper deposition | MS-C2500 MS-C2600 |
| 11 | rinsing | — | — |
| 12 | Subsequent Process | Leads to electroplating | — |
Pre-treatment
Material preparation
- STEP1
Clean & Conditioner
Removal of fine oxide film on copper surface
Recommended productMS-C2000 - 2rinsing
- STEP3
Soft Etching
Forms fine irregularities on the board surface to enhance plating adhesion through anchoring effect and increased surface area. Functions to remove oxide film and neutralize residual alkali.
Recommended productMS-C2100 - 4rinsing