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PRODUCT DETAIL · PI-0051
Product DetailsMS-GOLD M
PI-0051 · MS-GOLD MPI-0051 · Plating Solutions / Electroless Gold
PRODUCT · PI-0051
MS-GOLD M
Electroless GoldProduct Features
MS-GOLD M is a displacement gold plating bath for gold plating on electroless nickel.
PRODUCT SPECIFICATION · PI-0051
MS-GOLD M
Plating Solutions / Electroless GoldProduct Information
- Product ID
- PI-0051
- Product Group
- Electroless Gold ↗Electroless Gold ↗
- Features
- MS-GOLD M is a displacement gold plating bath for gold plating on electroless nickel.
- Deposition Thickness / Time
- 0.05㎛ / 10min
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