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PROCESS DETAIL · AP-005
Process DetailIndium (In) plating process on a wafer
AP-005 · Indium (In) plating process on a waferAP-005 · Electronic · Circuit
PROCESS INFORMATION · AP-005
Indium (In) plating process on a wafer
Electronics · Circuit- Process ID
- AP-005
- Process Categories
- Electronics · Circuit
- Applications
- Semiconductor wafer
- Related Industries
- Semiconductor
Process Sequence
10 steps
| Process order | Process Name | Process Description | Recommended product |
|---|---|---|---|
| 1 | Degreasing | — | MS TOP CLEAN |
| 2 | rinsing | — | — |
| 3 | Activation | — | — |
| 4 | rinsing | — | — |
| 5 | Ni base plating | — | MS-200S |
| 6 | rinsing | — | — |
| 7 | Strike | — | |
| 8 | Electroplating | Indium Build Up | |
| 9 | rinsing | — | — |
| 10 | Drying | — | — |
Pre-treatment
Material preparation
- STEP1
Degreasing
Recommended productMS TOP CLEAN - 2rinsing
RELATED PRODUCTS